Hi Zach/Ricardo,
All the thermal Kconfigs are enabled in https://wiki.linaro.org/WorkingGroups/PowerManagement/Doc/Kconfig.
Thanks,
Amit D
Amit, could you please add the required Kconfig options that need to
be enabled to https://wiki.linaro.org/WorkingGroups/PowerManagement/Doc/Kconfig
under Exynos->Thermal?
Zach and Ricardo will then ensure that their kernels have those
Kconfig options enabled.
/Amit
> _______________________________________________
On Wed, Dec 14, 2011 at 6:54 PM, Amit Kachhap <amit.kachhap@linaro.org> wrote:
> Hi Nicolas,
>
> Please pull my samsung thermal implementation work from git repository
> (git://git.linaro.org/people/amitdanielk/linux.git thermal_cpu_cooling).
> Some of the patches are under review and some are in mainline in 3.2 rc*
> version.
> It is all based on the tip of your tree.
>
> The patches are added since commit id
> 971be11492b1e248798f7078592b1fa0dfbf3534
>
> Thanks,
> Amit Daniel
>
>
> On 14 December 2011 20:11, Amit Kachhap <amit.kachhap@linaro.org> wrote:
>>
>> Hi Nicolas,
>>
>> Is it possible for you to add these 2 patches for this month release? I am
>> not able to give you the git link as there is seems some problem with the
>> linaro git server.
>> Also I attached the patches in case required.
>>
>> Thanks,
>> Amit Daniel
>>
>>
>> On 13 December 2011 20:43, Amit Daniel Kachhap <amit.kachhap@linaro.org>
>> wrote:
>> > PATCH 1) [thermal: Add a new trip type to use cooling device instance
>> > number]
>> > This patch adds a new trip type THERMAL_TRIP_STATE_ACTIVE which passes
>> > cooling device instance number and may be helpful for cpufreq cooling
>> > devices
>> > to take the correct cooling action.
>> >
>> > PATCH 2) [thermal: Add generic cpu cooling implementation]
>> > This patch adds generic cpu cooling low level implementation through
>> > frequency
>> > clipping and cpu hotplug. In future, other cpu related cooling devices
>> > may be
>> > added here. An ACPI version of this already
>> > exists(drivers/acpi/processor_thermal.c).
>> > But this will be useful for platforms like ARM using the generic thermal
>> > interface
>> > along with the generic cpu cooling devices. The cooling device
>> > registration API's
>> > return cooling device pointers which can be easily binded with the
>> > thermal zone
>> > trip points.
>> >
>> >
>> > Amit Daniel Kachhap (2):
>> > thermal: Add a new trip type to use cooling device instance number
>> > thermal: Add generic cpu cooling implementation
>> >
>> > Documentation/thermal/cpu-cooling-api.txt | 52 +++++
>> > Documentation/thermal/sysfs-api.txt | 4 +-
>> > drivers/thermal/Kconfig | 11 +
>> > drivers/thermal/Makefile | 1 +
>> > drivers/thermal/cpu_cooling.c | 302
>> > +++++++++++++++++++++++++++++
>> > drivers/thermal/thermal_sys.c | 27 +++-
>> > include/linux/cpu_cooling.h | 45 +++++
>> > include/linux/thermal.h | 1 +
>> > 8 files changed, 440 insertions(+), 3 deletions(-)
>> > create mode 100644 Documentation/thermal/cpu-cooling-api.txt
>> > create mode 100644 drivers/thermal/cpu_cooling.c
>> > create mode 100644 include/linux/cpu_cooling.h
>> >
>>
>
>
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