On 13 December 2011 20:43, Amit Daniel Kachhap <
amit.kachhap@linaro.org> wrote:
> PATCH 1) [thermal: Add a new trip type to use cooling device instance number]
> This patch adds a new trip type THERMAL_TRIP_STATE_ACTIVE which passes
> cooling device instance number and may be helpful for cpufreq cooling devices
> to take the correct cooling action.
>
> PATCH 2) [thermal: Add generic cpu cooling implementation]
> This patch adds generic cpu cooling low level implementation through frequency
> clipping and cpu hotplug. In future, other cpu related cooling devices may be
> added here. An ACPI version of this already exists(drivers/acpi/processor_thermal.c).
> But this will be useful for platforms like ARM using the generic thermal interface
> along with the generic cpu cooling devices. The cooling device registration API's
> return cooling device pointers which can be easily binded with the thermal zone
> trip points.
>
>
> Amit Daniel Kachhap (2):
> thermal: Add a new trip type to use cooling device instance number
> thermal: Add generic cpu cooling implementation
>
> Documentation/thermal/cpu-cooling-api.txt | 52 +++++
> Documentation/thermal/sysfs-api.txt | 4 +-
> drivers/thermal/Kconfig | 11 +
> drivers/thermal/Makefile | 1 +
> drivers/thermal/cpu_cooling.c | 302 +++++++++++++++++++++++++++++
> drivers/thermal/thermal_sys.c | 27 +++-
> include/linux/cpu_cooling.h | 45 +++++
> include/linux/thermal.h | 1 +
> 8 files changed, 440 insertions(+), 3 deletions(-)
> create mode 100644 Documentation/thermal/cpu-cooling-api.txt
> create mode 100644 drivers/thermal/cpu_cooling.c
> create mode 100644 include/linux/cpu_cooling.h
>