On 09/04/13 00:20, Alexander Sack wrote:Or we could put a heatsink/active cooling on the PandaES boards?
Paul,
you suggest to use different configurations for doing the "build the
kernel" validation and the benchmarking? Why wouldn't we run in the same
heat issues while benchmarking?
Can we somehow put the SoC into a very low power state for 2 minutes for
cool down and simply wait before starting the build/test?
As Paul says elsewhere we hammer the boards continuously for a number of hours, being cool before we start isn't going to help much.Yes.
Anyway, I assume that the strict environment requirement where toolchain WG
needs to sign off on the setup would mostly apply to benchmarking only and
that we could probably choose any stable image for doing the build
validation of the toolchain that is rock solid. Matt?
My requirements for the kernel/filesystem image used for building are that:
a) It works
b) It doesn't change regularly :-).
For benchmarking we need to use a known good (and special) kernel and filesystem which changes irregularly.
Thanks,
Matt
--
Matthew Gretton-Dann
Toolchain Working Group, Linaro