On Tue, Apr 9, 2013 at 2:47 PM, Matthew Gretton-Dann <matthew.gretton-dann@linaro.org> wrote:

On 09/04/13 00:20, Alexander Sack wrote:

Paul,

you suggest to use different configurations for doing the "build the
kernel" validation and the benchmarking? Why wouldn't we run in the same
heat issues while benchmarking?

Can we somehow put the SoC into a very low power state for 2 minutes for
cool down and simply wait before starting the build/test?

Or we could put a heatsink/active cooling on the PandaES boards?

As Paul says elsewhere we hammer the boards continuously for a number of hours, being cool before we start isn't going to help much.

Anyway, I assume that the strict environment requirement where toolchain WG
needs to sign off on the setup would mostly apply to benchmarking only and
that we could probably choose any stable image for doing the build
validation of the toolchain that is rock solid. Matt?

Yes.

My requirements for the kernel/filesystem image used for building are that:
 a) It works
 b) It doesn't change regularly :-).

I believe point b) is talking solutions for the requirement of minimal noise caused by false negatives. With that, I believe it is like I said. We can use whatever we feel is stable as long as we protect you from noise when we decide to change stuff...

 

For benchmarking we need to use a known good (and special) kernel and filesystem which changes irregularly.

Thanks,

Matt

--
Matthew Gretton-Dann
Toolchain Working Group, Linaro

--
Alexander Sack
Director, Linaro Platform Engineering
http://www.linaro.org | Open source software for ARM SoCs
http://twitter.com/#!/linaroorg - http://www.linaro.org/linaro-blog

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