From: Eduardo Valentin eduardo.valentin@ti.com
This patch introduces a device tree bindings for describing the hardware thermal behavior and limits. Also a parser to read and interpret the data and feed it in the thermal framework is presented.
This patch introduces a thermal data parser for device tree. The parsed data is used to build thermal zones and thermal binding parameters. The output data can then be used to deploy thermal policies.
This patch adds also documentation regarding this API and how to define tree nodes to use this infrastructure.
Note that, in order to be able to have control on the sensor registration on the DT thermal zone, it was required to allow changing the thermal zone .get_temp callback. For this reason, this patch also removes the 'const' modifier from the .ops field of thermal zone devices.
Cc: Zhang Rui rui.zhang@intel.com Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Acked-by: Mark Rutland mark.rutland@arm.com Signed-off-by: Eduardo Valentin eduardo.valentin@ti.com (cherry picked from commit 4e5e4705bf69ea450f58fc709ac5888f321a9299)
Signed-off-by: Alex Shi alex.shi@linaro.org --- .../devicetree/bindings/thermal/thermal.txt | 595 +++++++++++++++ drivers/thermal/Kconfig | 13 + drivers/thermal/Makefile | 1 + drivers/thermal/of-thermal.c | 849 +++++++++++++++++++++ drivers/thermal/thermal_core.c | 9 +- drivers/thermal/thermal_core.h | 9 + include/dt-bindings/thermal/thermal.h | 17 + include/linux/thermal.h | 28 +- 8 files changed, 1518 insertions(+), 3 deletions(-) create mode 100644 Documentation/devicetree/bindings/thermal/thermal.txt create mode 100644 drivers/thermal/of-thermal.c create mode 100644 include/dt-bindings/thermal/thermal.h
diff --git a/Documentation/devicetree/bindings/thermal/thermal.txt b/Documentation/devicetree/bindings/thermal/thermal.txt new file mode 100644 index 0000000..f5db6b7 --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/thermal.txt @@ -0,0 +1,595 @@ +* Thermal Framework Device Tree descriptor + +This file describes a generic binding to provide a way of +defining hardware thermal structure using device tree. +A thermal structure includes thermal zones and their components, +such as trip points, polling intervals, sensors and cooling devices +binding descriptors. + +The target of device tree thermal descriptors is to describe only +the hardware thermal aspects. The thermal device tree bindings are +not about how the system must control or which algorithm or policy +must be taken in place. + +There are five types of nodes involved to describe thermal bindings: +- thermal sensors: devices which may be used to take temperature + measurements. +- cooling devices: devices which may be used to dissipate heat. +- trip points: describe key temperatures at which cooling is recommended. The + set of points should be chosen based on hardware limits. +- cooling maps: used to describe links between trip points and cooling devices; +- thermal zones: used to describe thermal data within the hardware; + +The following is a description of each of these node types. + +* Thermal sensor devices + +Thermal sensor devices are nodes providing temperature sensing capabilities on +thermal zones. Typical devices are I2C ADC converters and bandgaps. These are +nodes providing temperature data to thermal zones. Thermal sensor devices may +control one or more internal sensors. + +Required property: +- #thermal-sensor-cells: Used to provide sensor device specific information + Type: unsigned while referring to it. Typically 0 on thermal sensor + Size: one cell nodes with only one sensor, and at least 1 on nodes + with several internal sensors, in order + to identify uniquely the sensor instances within + the IC. See thermal zone binding for more details + on how consumers refer to sensor devices. + +* Cooling device nodes + +Cooling devices are nodes providing control on power dissipation. There +are essentially two ways to provide control on power dissipation. First +is by means of regulating device performance, which is known as passive +cooling. A typical passive cooling is a CPU that has dynamic voltage and +frequency scaling (DVFS), and uses lower frequencies as cooling states. +Second is by means of activating devices in order to remove +the dissipated heat, which is known as active cooling, e.g. regulating +fan speeds. In both cases, cooling devices shall have a way to determine +the state of cooling in which the device is. + +Any cooling device has a range of cooling states (i.e. different levels +of heat dissipation). For example a fan's cooling states correspond to +the different fan speeds possible. Cooling states are referred to by +single unsigned integers, where larger numbers mean greater heat +dissipation. The precise set of cooling states associated with a device +(as referred to be the cooling-min-state and cooling-max-state +properties) should be defined in a particular device's binding. +For more examples of cooling devices, refer to the example sections below. + +Required properties: +- cooling-min-state: An integer indicating the smallest + Type: unsigned cooling state accepted. Typically 0. + Size: one cell + +- cooling-max-state: An integer indicating the largest + Type: unsigned cooling state accepted. + Size: one cell + +- #cooling-cells: Used to provide cooling device specific information + Type: unsigned while referring to it. Must be at least 2, in order + Size: one cell to specify minimum and maximum cooling state used + in the reference. The first cell is the minimum + cooling state requested and the second cell is + the maximum cooling state requested in the reference. + See Cooling device maps section below for more details + on how consumers refer to cooling devices. + +* Trip points + +The trip node is a node to describe a point in the temperature domain +in which the system takes an action. This node describes just the point, +not the action. + +Required properties: +- temperature: An integer indicating the trip temperature level, + Type: signed in millicelsius. + Size: one cell + +- hysteresis: A low hysteresis value on temperature property (above). + Type: unsigned This is a relative value, in millicelsius. + Size: one cell + +- type: a string containing the trip type. Expected values are: + "active": A trip point to enable active cooling + "passive": A trip point to enable passive cooling + "hot": A trip point to notify emergency + "critical": Hardware not reliable. + Type: string + +* Cooling device maps + +The cooling device maps node is a node to describe how cooling devices +get assigned to trip points of the zone. The cooling devices are expected +to be loaded in the target system. + +Required properties: +- cooling-device: A phandle of a cooling device with its specifier, + Type: phandle + referring to which cooling device is used in this + cooling specifier binding. In the cooling specifier, the first cell + is the minimum cooling state and the second cell + is the maximum cooling state used in this map. +- trip: A phandle of a trip point node within the same thermal + Type: phandle of zone. + trip point node + +Optional property: +- contribution: The cooling contribution to the thermal zone of the + Type: unsigned referred cooling device at the referred trip point. + Size: one cell The contribution is a ratio of the sum + of all cooling contributions within a thermal zone. + +Note: Using the THERMAL_NO_LIMIT (-1UL) constant in the cooling-device phandle +limit specifier means: +(i) - minimum state allowed for minimum cooling state used in the reference. +(ii) - maximum state allowed for maximum cooling state used in the reference. +Refer to include/dt-bindings/thermal/thermal.h for definition of this constant. + +* Thermal zone nodes + +The thermal zone node is the node containing all the required info +for describing a thermal zone, including its cooling device bindings. The +thermal zone node must contain, apart from its own properties, one sub-node +containing trip nodes and one sub-node containing all the zone cooling maps. + +Required properties: +- polling-delay: The maximum number of milliseconds to wait between polls + Type: unsigned when checking this thermal zone. + Size: one cell + +- polling-delay-passive: The maximum number of milliseconds to wait + Type: unsigned between polls when performing passive cooling. + Size: one cell + +- thermal-sensors: A list of thermal sensor phandles and sensor specifier + Type: list of used while monitoring the thermal zone. + phandles + sensor + specifier + +- trips: A sub-node which is a container of only trip point nodes + Type: sub-node required to describe the thermal zone. + +- cooling-maps: A sub-node which is a container of only cooling device + Type: sub-node map nodes, used to describe the relation between trips + and cooling devices. + +Optional property: +- coefficients: An array of integers (one signed cell) containing + Type: array coefficients to compose a linear relation between + Elem size: one cell the sensors listed in the thermal-sensors property. + Elem type: signed Coefficients defaults to 1, in case this property + is not specified. A simple linear polynomial is used: + Z = c0 * x0 + c1 + x1 + ... + c(n-1) * x(n-1) + cn. + + The coefficients are ordered and they match with sensors + by means of sensor ID. Additional coefficients are + interpreted as constant offset. + +Note: The delay properties are bound to the maximum dT/dt (temperature +derivative over time) in two situations for a thermal zone: +(i) - when passive cooling is activated (polling-delay-passive); and +(ii) - when the zone just needs to be monitored (polling-delay) or +when active cooling is activated. + +The maximum dT/dt is highly bound to hardware power consumption and dissipation +capability. The delays should be chosen to account for said max dT/dt, +such that a device does not cross several trip boundaries unexpectedly +between polls. Choosing the right polling delays shall avoid having the +device in temperature ranges that may damage the silicon structures and +reduce silicon lifetime. + +* The thermal-zones node + +The "thermal-zones" node is a container for all thermal zone nodes. It shall +contain only sub-nodes describing thermal zones as in the section +"Thermal zone nodes". The "thermal-zones" node appears under "/". + +* Examples + +Below are several examples on how to use thermal data descriptors +using device tree bindings: + +(a) - CPU thermal zone + +The CPU thermal zone example below describes how to setup one thermal zone +using one single sensor as temperature source and many cooling devices and +power dissipation control sources. + +#include <dt-bindings/thermal/thermal.h> + +cpus { + /* + * Here is an example of describing a cooling device for a DVFS + * capable CPU. The CPU node describes its four OPPs. + * The cooling states possible are 0..3, and they are + * used as OPP indexes. The minimum cooling state is 0, which means + * all four OPPs can be available to the system. The maximum + * cooling state is 3, which means only the lowest OPPs (198MHz@0.85V) + * can be available in the system. + */ + cpu0: cpu@0 { + ... + operating-points = < + /* kHz uV */ + 970000 1200000 + 792000 1100000 + 396000 950000 + 198000 850000 + >; + cooling-min-state = <0>; + cooling-max-state = <3>; + #cooling-cells = <2>; /* min followed by max */ + }; + ... +}; + +&i2c1 { + ... + /* + * A simple fan controller which supports 10 speeds of operation + * (represented as 0-9). + */ + fan0: fan@0x48 { + ... + cooling-min-state = <0>; + cooling-max-state = <9>; + #cooling-cells = <2>; /* min followed by max */ + }; +}; + +ocp { + ... + /* + * A simple IC with a single bandgap temperature sensor. + */ + bandgap0: bandgap@0x0000ED00 { + ... + #thermal-sensor-cells = <0>; + }; +}; + +thermal-zones { + cpu-thermal: cpu-thermal { + polling-delay-passive = <250>; /* milliseconds */ + polling-delay = <1000>; /* milliseconds */ + + thermal-sensors = <&bandgap0>; + + trips { + cpu-alert0: cpu-alert { + temperature = <90000>; /* millicelsius */ + hysteresis = <2000>; /* millicelsius */ + type = "active"; + }; + cpu-alert1: cpu-alert { + temperature = <100000>; /* millicelsius */ + hysteresis = <2000>; /* millicelsius */ + type = "passive"; + }; + cpu-crit: cpu-crit { + temperature = <125000>; /* millicelsius */ + hysteresis = <2000>; /* millicelsius */ + type = "critical"; + }; + }; + + cooling-maps { + map0 { + trip = <&cpu-alert0>; + cooling-device = <&fan0 THERMAL_NO_LIMITS 4>; + }; + map1 { + trip = <&cpu-alert1>; + cooling-device = <&fan0 5 THERMAL_NO_LIMITS>; + }; + map2 { + trip = <&cpu-alert1>; + cooling-device = + <&cpu0 THERMAL_NO_LIMITS THERMAL_NO_LIMITS>; + }; + }; + }; +}; + +In the example above, the ADC sensor (bandgap0) at address 0x0000ED00 is +used to monitor the zone 'cpu-thermal' using its sole sensor. A fan +device (fan0) is controlled via I2C bus 1, at address 0x48, and has ten +different cooling states 0-9. It is used to remove the heat out of +the thermal zone 'cpu-thermal' using its cooling states +from its minimum to 4, when it reaches trip point 'cpu-alert0' +at 90C, as an example of active cooling. The same cooling device is used at +'cpu-alert1', but from 5 to its maximum state. The cpu@0 device is also +linked to the same thermal zone, 'cpu-thermal', as a passive cooling device, +using all its cooling states at trip point 'cpu-alert1', +which is a trip point at 100C. On the thermal zone 'cpu-thermal', at the +temperature of 125C, represented by the trip point 'cpu-crit', the silicon +is not reliable anymore. + +(b) - IC with several internal sensors + +The example below describes how to deploy several thermal zones based off a +single sensor IC, assuming it has several internal sensors. This is a common +case on SoC designs with several internal IPs that may need different thermal +requirements, and thus may have their own sensor to monitor or detect internal +hotspots in their silicon. + +#include <dt-bindings/thermal/thermal.h> + +ocp { + ... + /* + * A simple IC with several bandgap temperature sensors. + */ + bandgap0: bandgap@0x0000ED00 { + ... + #thermal-sensor-cells = <1>; + }; +}; + +thermal-zones { + cpu-thermal: cpu-thermal { + polling-delay-passive = <250>; /* milliseconds */ + polling-delay = <1000>; /* milliseconds */ + + /* sensor ID */ + thermal-sensors = <&bandgap0 0>; + + trips { + /* each zone within the SoC may have its own trips */ + cpu-alert: cpu-alert { + temperature = <100000>; /* millicelsius */ + hysteresis = <2000>; /* millicelsius */ + type = "passive"; + }; + cpu-crit: cpu-crit { + temperature = <125000>; /* millicelsius */ + hysteresis = <2000>; /* millicelsius */ + type = "critical"; + }; + }; + + cooling-maps { + /* each zone within the SoC may have its own cooling */ + ... + }; + }; + + gpu-thermal: gpu-thermal { + polling-delay-passive = <120>; /* milliseconds */ + polling-delay = <1000>; /* milliseconds */ + + /* sensor ID */ + thermal-sensors = <&bandgap0 1>; + + trips { + /* each zone within the SoC may have its own trips */ + gpu-alert: gpu-alert { + temperature = <90000>; /* millicelsius */ + hysteresis = <2000>; /* millicelsius */ + type = "passive"; + }; + gpu-crit: gpu-crit { + temperature = <105000>; /* millicelsius */ + hysteresis = <2000>; /* millicelsius */ + type = "critical"; + }; + }; + + cooling-maps { + /* each zone within the SoC may have its own cooling */ + ... + }; + }; + + dsp-thermal: dsp-thermal { + polling-delay-passive = <50>; /* milliseconds */ + polling-delay = <1000>; /* milliseconds */ + + /* sensor ID */ + thermal-sensors = <&bandgap0 2>; + + trips { + /* each zone within the SoC may have its own trips */ + dsp-alert: gpu-alert { + temperature = <90000>; /* millicelsius */ + hysteresis = <2000>; /* millicelsius */ + type = "passive"; + }; + dsp-crit: gpu-crit { + temperature = <135000>; /* millicelsius */ + hysteresis = <2000>; /* millicelsius */ + type = "critical"; + }; + }; + + cooling-maps { + /* each zone within the SoC may have its own cooling */ + ... + }; + }; +}; + +In the example above, there is one bandgap IC which has the capability to +monitor three sensors. The hardware has been designed so that sensors are +placed on different places in the DIE to monitor different temperature +hotspots: one for CPU thermal zone, one for GPU thermal zone and the +other to monitor a DSP thermal zone. + +Thus, there is a need to assign each sensor provided by the bandgap IC +to different thermal zones. This is achieved by means of using the +#thermal-sensor-cells property and using the first cell of the sensor +specifier as sensor ID. In the example, then, <bandgap 0> is used to +monitor CPU thermal zone, <bandgap 1> is used to monitor GPU thermal +zone and <bandgap 2> is used to monitor DSP thermal zone. Each zone +may be uncorrelated, having its own dT/dt requirements, trips +and cooling maps. + + +(c) - Several sensors within one single thermal zone + +The example below illustrates how to use more than one sensor within +one thermal zone. + +#include <dt-bindings/thermal/thermal.h> + +&i2c1 { + ... + /* + * A simple IC with a single temperature sensor. + */ + adc: sensor@0x49 { + ... + #thermal-sensor-cells = <0>; + }; +}; + +ocp { + ... + /* + * A simple IC with a single bandgap temperature sensor. + */ + bandgap0: bandgap@0x0000ED00 { + ... + #thermal-sensor-cells = <0>; + }; +}; + +thermal-zones { + cpu-thermal: cpu-thermal { + polling-delay-passive = <250>; /* milliseconds */ + polling-delay = <1000>; /* milliseconds */ + + thermal-sensors = <&bandgap0>, /* cpu */ + <&adc>; /* pcb north */ + + /* hotspot = 100 * bandgap - 120 * adc + 484 */ + coefficients = <100 -120 484>; + + trips { + ... + }; + + cooling-maps { + ... + }; + }; +}; + +In some cases, there is a need to use more than one sensor to extrapolate +a thermal hotspot in the silicon. The above example illustrates this situation. +For instance, it may be the case that a sensor external to CPU IP may be placed +close to CPU hotspot and together with internal CPU sensor, it is used +to determine the hotspot. Assuming this is the case for the above example, +the hypothetical extrapolation rule would be: + hotspot = 100 * bandgap - 120 * adc + 484 + +In other context, the same idea can be used to add fixed offset. For instance, +consider the hotspot extrapolation rule below: + hotspot = 1 * adc + 6000 + +In the above equation, the hotspot is always 6C higher than what is read +from the ADC sensor. The binding would be then: + thermal-sensors = <&adc>; + + /* hotspot = 1 * adc + 6000 */ + coefficients = <1 6000>; + +(d) - Board thermal + +The board thermal example below illustrates how to setup one thermal zone +with many sensors and many cooling devices. + +#include <dt-bindings/thermal/thermal.h> + +&i2c1 { + ... + /* + * An IC with several temperature sensor. + */ + adc-dummy: sensor@0x50 { + ... + #thermal-sensor-cells = <1>; /* sensor internal ID */ + }; +}; + +thermal-zones { + batt-thermal { + polling-delay-passive = <500>; /* milliseconds */ + polling-delay = <2500>; /* milliseconds */ + + /* sensor ID */ + thermal-sensors = <&adc-dummy 4>; + + trips { + ... + }; + + cooling-maps { + ... + }; + }; + + board-thermal: board-thermal { + polling-delay-passive = <1000>; /* milliseconds */ + polling-delay = <2500>; /* milliseconds */ + + /* sensor ID */ + thermal-sensors = <&adc-dummy 0>, /* pcb top edge */ + <&adc-dummy 1>, /* lcd */ + <&adc-dymmy 2>; /* back cover */ + /* + * An array of coefficients describing the sensor + * linear relation. E.g.: + * z = c1*x1 + c2*x2 + c3*x3 + */ + coefficients = <1200 -345 890>; + + trips { + /* Trips are based on resulting linear equation */ + cpu-trip: cpu-trip { + temperature = <60000>; /* millicelsius */ + hysteresis = <2000>; /* millicelsius */ + type = "passive"; + }; + gpu-trip: gpu-trip { + temperature = <55000>; /* millicelsius */ + hysteresis = <2000>; /* millicelsius */ + type = "passive"; + } + lcd-trip: lcp-trip { + temperature = <53000>; /* millicelsius */ + hysteresis = <2000>; /* millicelsius */ + type = "passive"; + }; + crit-trip: crit-trip { + temperature = <68000>; /* millicelsius */ + hysteresis = <2000>; /* millicelsius */ + type = "critical"; + }; + }; + + cooling-maps { + map0 { + trip = <&cpu-trip>; + cooling-device = <&cpu0 0 2>; + contribution = <55>; + }; + map1 { + trip = <&gpu-trip>; + cooling-device = <&gpu0 0 2>; + contribution = <20>; + }; + map2 { + trip = <&lcd-trip>; + cooling-device = <&lcd0 5 10>; + contribution = <15>; + }; + }; + }; +}; + +The above example is a mix of previous examples, a sensor IP with several internal +sensors used to monitor different zones, one of them is composed by several sensors and +with different cooling devices. diff --git a/drivers/thermal/Kconfig b/drivers/thermal/Kconfig index d8448bf..3630c07 100644 --- a/drivers/thermal/Kconfig +++ b/drivers/thermal/Kconfig @@ -29,6 +29,19 @@ config THERMAL_HWMON Say 'Y' here if you want all thermal sensors to have hwmon sysfs interface too.
+config THERMAL_OF + bool + prompt "APIs to parse thermal data out of device tree" + depends on OF + default y + help + This options provides helpers to add the support to + read and parse thermal data definitions out of the + device tree blob. + + Say 'Y' here if you need to build thermal infrastructure + based on device tree. + choice prompt "Default Thermal governor" default THERMAL_DEFAULT_GOV_STEP_WISE diff --git a/drivers/thermal/Makefile b/drivers/thermal/Makefile index db989e9..71f8eef 100644 --- a/drivers/thermal/Makefile +++ b/drivers/thermal/Makefile @@ -7,6 +7,7 @@ thermal_sys-y += thermal_core.o
# interface to/from other layers providing sensors thermal_sys-$(CONFIG_THERMAL_HWMON) += thermal_hwmon.o +thermal_sys-$(CONFIG_THERMAL_OF) += of-thermal.o
# governors thermal_sys-$(CONFIG_THERMAL_GOV_FAIR_SHARE) += fair_share.o diff --git a/drivers/thermal/of-thermal.c b/drivers/thermal/of-thermal.c new file mode 100644 index 0000000..04b1be7 --- /dev/null +++ b/drivers/thermal/of-thermal.c @@ -0,0 +1,849 @@ +/* + * of-thermal.c - Generic Thermal Management device tree support. + * + * Copyright (C) 2013 Texas Instruments + * Copyright (C) 2013 Eduardo Valentin eduardo.valentin@ti.com + * + * + * ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~ + * + * This program is free software; you can redistribute it and/or modify + * it under the terms of the GNU General Public License as published by + * the Free Software Foundation; version 2 of the License. + * + * This program is distributed in the hope that it will be useful, but + * WITHOUT ANY WARRANTY; without even the implied warranty of + * MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE. See the GNU + * General Public License for more details. + * + * You should have received a copy of the GNU General Public License along + * with this program; if not, write to the Free Software Foundation, Inc., + * 59 Temple Place, Suite 330, Boston, MA 02111-1307 USA. + * + * ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~ + */ +#include <linux/thermal.h> +#include <linux/slab.h> +#include <linux/types.h> +#include <linux/of_device.h> +#include <linux/of_platform.h> +#include <linux/err.h> +#include <linux/export.h> +#include <linux/string.h> + +#include "thermal_core.h" + +/*** Private data structures to represent thermal device tree data ***/ + +/** + * struct __thermal_trip - representation of a point in temperature domain + * @np: pointer to struct device_node that this trip point was created from + * @temperature: temperature value in miliCelsius + * @hysteresis: relative hysteresis in miliCelsius + * @type: trip point type + */ + +struct __thermal_trip { + struct device_node *np; + unsigned long int temperature; + unsigned long int hysteresis; + enum thermal_trip_type type; +}; + +/** + * struct __thermal_bind_param - a match between trip and cooling device + * @cooling_device: a pointer to identify the referred cooling device + * @trip_id: the trip point index + * @usage: the percentage (from 0 to 100) of cooling contribution + * @min: minimum cooling state used at this trip point + * @max: maximum cooling state used at this trip point + */ + +struct __thermal_bind_params { + struct device_node *cooling_device; + unsigned int trip_id; + unsigned int usage; + unsigned long min; + unsigned long max; +}; + +/** + * struct __thermal_zone - internal representation of a thermal zone + * @mode: current thermal zone device mode (enabled/disabled) + * @passive_delay: polling interval while passive cooling is activated + * @polling_delay: zone polling interval + * @ntrips: number of trip points + * @trips: an array of trip points (0..ntrips - 1) + * @num_tbps: number of thermal bind params + * @tbps: an array of thermal bind params (0..num_tbps - 1) + * @sensor_data: sensor private data used while reading temperature and trend + * @get_temp: sensor callback to read temperature + * @get_trend: sensor callback to read temperature trend + */ + +struct __thermal_zone { + enum thermal_device_mode mode; + int passive_delay; + int polling_delay; + + /* trip data */ + int ntrips; + struct __thermal_trip *trips; + + /* cooling binding data */ + int num_tbps; + struct __thermal_bind_params *tbps; + + /* sensor interface */ + void *sensor_data; + int (*get_temp)(void *, long *); + int (*get_trend)(void *, long *); +}; + +/*** DT thermal zone device callbacks ***/ + +static int of_thermal_get_temp(struct thermal_zone_device *tz, + unsigned long *temp) +{ + struct __thermal_zone *data = tz->devdata; + + if (!data->get_temp) + return -EINVAL; + + return data->get_temp(data->sensor_data, temp); +} + +static int of_thermal_get_trend(struct thermal_zone_device *tz, int trip, + enum thermal_trend *trend) +{ + struct __thermal_zone *data = tz->devdata; + long dev_trend; + int r; + + if (!data->get_trend) + return -EINVAL; + + r = data->get_trend(data->sensor_data, &dev_trend); + if (r) + return r; + + /* TODO: These intervals might have some thresholds, but in core code */ + if (dev_trend > 0) + *trend = THERMAL_TREND_RAISING; + else if (dev_trend < 0) + *trend = THERMAL_TREND_DROPPING; + else + *trend = THERMAL_TREND_STABLE; + + return 0; +} + +static int of_thermal_bind(struct thermal_zone_device *thermal, + struct thermal_cooling_device *cdev) +{ + struct __thermal_zone *data = thermal->devdata; + int i; + + if (!data || IS_ERR(data)) + return -ENODEV; + + /* find where to bind */ + for (i = 0; i < data->num_tbps; i++) { + struct __thermal_bind_params *tbp = data->tbps + i; + + if (tbp->cooling_device == cdev->np) { + int ret; + + ret = thermal_zone_bind_cooling_device(thermal, + tbp->trip_id, cdev, + tbp->min, + tbp->max); + if (ret) + return ret; + } + } + + return 0; +} + +static int of_thermal_unbind(struct thermal_zone_device *thermal, + struct thermal_cooling_device *cdev) +{ + struct __thermal_zone *data = thermal->devdata; + int i; + + if (!data || IS_ERR(data)) + return -ENODEV; + + /* find where to unbind */ + for (i = 0; i < data->num_tbps; i++) { + struct __thermal_bind_params *tbp = data->tbps + i; + + if (tbp->cooling_device == cdev->np) { + int ret; + + ret = thermal_zone_unbind_cooling_device(thermal, + tbp->trip_id, cdev); + if (ret) + return ret; + } + } + + return 0; +} + +static int of_thermal_get_mode(struct thermal_zone_device *tz, + enum thermal_device_mode *mode) +{ + struct __thermal_zone *data = tz->devdata; + + *mode = data->mode; + + return 0; +} + +static int of_thermal_set_mode(struct thermal_zone_device *tz, + enum thermal_device_mode mode) +{ + struct __thermal_zone *data = tz->devdata; + + mutex_lock(&tz->lock); + + if (mode == THERMAL_DEVICE_ENABLED) + tz->polling_delay = data->polling_delay; + else + tz->polling_delay = 0; + + mutex_unlock(&tz->lock); + + data->mode = mode; + thermal_zone_device_update(tz); + + return 0; +} + +static int of_thermal_get_trip_type(struct thermal_zone_device *tz, int trip, + enum thermal_trip_type *type) +{ + struct __thermal_zone *data = tz->devdata; + + if (trip >= data->ntrips || trip < 0) + return -EDOM; + + *type = data->trips[trip].type; + + return 0; +} + +static int of_thermal_get_trip_temp(struct thermal_zone_device *tz, int trip, + unsigned long *temp) +{ + struct __thermal_zone *data = tz->devdata; + + if (trip >= data->ntrips || trip < 0) + return -EDOM; + + *temp = data->trips[trip].temperature; + + return 0; +} + +static int of_thermal_set_trip_temp(struct thermal_zone_device *tz, int trip, + unsigned long temp) +{ + struct __thermal_zone *data = tz->devdata; + + if (trip >= data->ntrips || trip < 0) + return -EDOM; + + /* thermal framework should take care of data->mask & (1 << trip) */ + data->trips[trip].temperature = temp; + + return 0; +} + +static int of_thermal_get_trip_hyst(struct thermal_zone_device *tz, int trip, + unsigned long *hyst) +{ + struct __thermal_zone *data = tz->devdata; + + if (trip >= data->ntrips || trip < 0) + return -EDOM; + + *hyst = data->trips[trip].hysteresis; + + return 0; +} + +static int of_thermal_set_trip_hyst(struct thermal_zone_device *tz, int trip, + unsigned long hyst) +{ + struct __thermal_zone *data = tz->devdata; + + if (trip >= data->ntrips || trip < 0) + return -EDOM; + + /* thermal framework should take care of data->mask & (1 << trip) */ + data->trips[trip].hysteresis = hyst; + + return 0; +} + +static int of_thermal_get_crit_temp(struct thermal_zone_device *tz, + unsigned long *temp) +{ + struct __thermal_zone *data = tz->devdata; + int i; + + for (i = 0; i < data->ntrips; i++) + if (data->trips[i].type == THERMAL_TRIP_CRITICAL) { + *temp = data->trips[i].temperature; + return 0; + } + + return -EINVAL; +} + +static struct thermal_zone_device_ops of_thermal_ops = { + .get_mode = of_thermal_get_mode, + .set_mode = of_thermal_set_mode, + + .get_trip_type = of_thermal_get_trip_type, + .get_trip_temp = of_thermal_get_trip_temp, + .set_trip_temp = of_thermal_set_trip_temp, + .get_trip_hyst = of_thermal_get_trip_hyst, + .set_trip_hyst = of_thermal_set_trip_hyst, + .get_crit_temp = of_thermal_get_crit_temp, + + .bind = of_thermal_bind, + .unbind = of_thermal_unbind, +}; + +/*** sensor API ***/ + +static struct thermal_zone_device * +thermal_zone_of_add_sensor(struct device_node *zone, + struct device_node *sensor, void *data, + int (*get_temp)(void *, long *), + int (*get_trend)(void *, long *)) +{ + struct thermal_zone_device *tzd; + struct __thermal_zone *tz; + + tzd = thermal_zone_get_zone_by_name(zone->name); + if (IS_ERR(tzd)) + return ERR_PTR(-EPROBE_DEFER); + + tz = tzd->devdata; + + mutex_lock(&tzd->lock); + tz->get_temp = get_temp; + tz->get_trend = get_trend; + tz->sensor_data = data; + + tzd->ops->get_temp = of_thermal_get_temp; + tzd->ops->get_trend = of_thermal_get_trend; + mutex_unlock(&tzd->lock); + + return tzd; +} + +/** + * thermal_zone_of_sensor_register - registers a sensor to a DT thermal zone + * @dev: a valid struct device pointer of a sensor device. Must contain + * a valid .of_node, for the sensor node. + * @sensor_id: a sensor identifier, in case the sensor IP has more + * than one sensors + * @data: a private pointer (owned by the caller) that will be passed + * back, when a temperature reading is needed. + * @get_temp: a pointer to a function that reads the sensor temperature. + * @get_trend: a pointer to a function that reads the sensor temperature trend. + * + * This function will search the list of thermal zones described in device + * tree and look for the zone that refer to the sensor device pointed by + * @dev->of_node as temperature providers. For the zone pointing to the + * sensor node, the sensor will be added to the DT thermal zone device. + * + * The thermal zone temperature is provided by the @get_temp function + * pointer. When called, it will have the private pointer @data back. + * + * The thermal zone temperature trend is provided by the @get_trend function + * pointer. When called, it will have the private pointer @data back. + * + * TODO: + * 01 - This function must enqueue the new sensor instead of using + * it as the only source of temperature values. + * + * 02 - There must be a way to match the sensor with all thermal zones + * that refer to it. + * + * Return: On success returns a valid struct thermal_zone_device, + * otherwise, it returns a corresponding ERR_PTR(). Caller must + * check the return value with help of IS_ERR() helper. + */ +struct thermal_zone_device * +thermal_zone_of_sensor_register(struct device *dev, int sensor_id, + void *data, int (*get_temp)(void *, long *), + int (*get_trend)(void *, long *)) +{ + struct device_node *np, *child, *sensor_np; + + np = of_find_node_by_name(NULL, "thermal-zones"); + if (!np) + return ERR_PTR(-ENODEV); + + if (!dev || !dev->of_node) + return ERR_PTR(-EINVAL); + + sensor_np = dev->of_node; + + for_each_child_of_node(np, child) { + struct of_phandle_args sensor_specs; + int ret, id; + + /* For now, thermal framework supports only 1 sensor per zone */ + ret = of_parse_phandle_with_args(child, "thermal-sensors", + "#thermal-sensor-cells", + 0, &sensor_specs); + if (ret) + continue; + + if (sensor_specs.args_count >= 1) { + id = sensor_specs.args[0]; + WARN(sensor_specs.args_count > 1, + "%s: too many cells in sensor specifier %d\n", + sensor_specs.np->name, sensor_specs.args_count); + } else { + id = 0; + } + + if (sensor_specs.np == sensor_np && id == sensor_id) { + of_node_put(np); + return thermal_zone_of_add_sensor(child, sensor_np, + data, + get_temp, + get_trend); + } + } + of_node_put(np); + + return ERR_PTR(-ENODEV); +} +EXPORT_SYMBOL_GPL(thermal_zone_of_sensor_register); + +/** + * thermal_zone_of_sensor_unregister - unregisters a sensor from a DT thermal zone + * @dev: a valid struct device pointer of a sensor device. Must contain + * a valid .of_node, for the sensor node. + * @tzd: a pointer to struct thermal_zone_device where the sensor is registered. + * + * This function removes the sensor callbacks and private data from the + * thermal zone device registered with thermal_zone_of_sensor_register() + * API. It will also silent the zone by remove the .get_temp() and .get_trend() + * thermal zone device callbacks. + * + * TODO: When the support to several sensors per zone is added, this + * function must search the sensor list based on @dev parameter. + * + */ +void thermal_zone_of_sensor_unregister(struct device *dev, + struct thermal_zone_device *tzd) +{ + struct __thermal_zone *tz; + + if (!dev || !tzd || !tzd->devdata) + return; + + tz = tzd->devdata; + + /* no __thermal_zone, nothing to be done */ + if (!tz) + return; + + mutex_lock(&tzd->lock); + tzd->ops->get_temp = NULL; + tzd->ops->get_trend = NULL; + + tz->get_temp = NULL; + tz->get_trend = NULL; + tz->sensor_data = NULL; + mutex_unlock(&tzd->lock); +} +EXPORT_SYMBOL_GPL(thermal_zone_of_sensor_unregister); + +/*** functions parsing device tree nodes ***/ + +/** + * thermal_of_populate_bind_params - parse and fill cooling map data + * @np: DT node containing a cooling-map node + * @__tbp: data structure to be filled with cooling map info + * @trips: array of thermal zone trip points + * @ntrips: number of trip points inside trips. + * + * This function parses a cooling-map type of node represented by + * @np parameter and fills the read data into @__tbp data structure. + * It needs the already parsed array of trip points of the thermal zone + * in consideration. + * + * Return: 0 on success, proper error code otherwise + */ +static int thermal_of_populate_bind_params(struct device_node *np, + struct __thermal_bind_params *__tbp, + struct __thermal_trip *trips, + int ntrips) +{ + struct of_phandle_args cooling_spec; + struct device_node *trip; + int ret, i; + u32 prop; + + /* Default weight. Usage is optional */ + __tbp->usage = 0; + ret = of_property_read_u32(np, "contribution", &prop); + if (ret == 0) + __tbp->usage = prop; + + trip = of_parse_phandle(np, "trip", 0); + if (!trip) { + pr_err("missing trip property\n"); + return -ENODEV; + } + + /* match using device_node */ + for (i = 0; i < ntrips; i++) + if (trip == trips[i].np) { + __tbp->trip_id = i; + break; + } + + if (i == ntrips) { + ret = -ENODEV; + goto end; + } + + ret = of_parse_phandle_with_args(np, "cooling-device", "#cooling-cells", + 0, &cooling_spec); + if (ret < 0) { + pr_err("missing cooling_device property\n"); + goto end; + } + __tbp->cooling_device = cooling_spec.np; + if (cooling_spec.args_count >= 2) { /* at least min and max */ + __tbp->min = cooling_spec.args[0]; + __tbp->max = cooling_spec.args[1]; + } else { + pr_err("wrong reference to cooling device, missing limits\n"); + } + +end: + of_node_put(trip); + + return ret; +} + +/** + * It maps 'enum thermal_trip_type' found in include/linux/thermal.h + * into the device tree binding of 'trip', property type. + */ +static const char * const trip_types[] = { + [THERMAL_TRIP_ACTIVE] = "active", + [THERMAL_TRIP_PASSIVE] = "passive", + [THERMAL_TRIP_HOT] = "hot", + [THERMAL_TRIP_CRITICAL] = "critical", +}; + +/** + * thermal_of_get_trip_type - Get phy mode for given device_node + * @np: Pointer to the given device_node + * @type: Pointer to resulting trip type + * + * The function gets trip type string from property 'type', + * and store its index in trip_types table in @type, + * + * Return: 0 on success, or errno in error case. + */ +static int thermal_of_get_trip_type(struct device_node *np, + enum thermal_trip_type *type) +{ + const char *t; + int err, i; + + err = of_property_read_string(np, "type", &t); + if (err < 0) + return err; + + for (i = 0; i < ARRAY_SIZE(trip_types); i++) + if (!strcasecmp(t, trip_types[i])) { + *type = i; + return 0; + } + + return -ENODEV; +} + +/** + * thermal_of_populate_trip - parse and fill one trip point data + * @np: DT node containing a trip point node + * @trip: trip point data structure to be filled up + * + * This function parses a trip point type of node represented by + * @np parameter and fills the read data into @trip data structure. + * + * Return: 0 on success, proper error code otherwise + */ +static int thermal_of_populate_trip(struct device_node *np, + struct __thermal_trip *trip) +{ + int prop; + int ret; + + ret = of_property_read_u32(np, "temperature", &prop); + if (ret < 0) { + pr_err("missing temperature property\n"); + return ret; + } + trip->temperature = prop; + + ret = of_property_read_u32(np, "hysteresis", &prop); + if (ret < 0) { + pr_err("missing hysteresis property\n"); + return ret; + } + trip->hysteresis = prop; + + ret = thermal_of_get_trip_type(np, &trip->type); + if (ret < 0) { + pr_err("wrong trip type property\n"); + return ret; + } + + /* Required for cooling map matching */ + trip->np = np; + + return 0; +} + +/** + * thermal_of_build_thermal_zone - parse and fill one thermal zone data + * @np: DT node containing a thermal zone node + * + * This function parses a thermal zone type of node represented by + * @np parameter and fills the read data into a __thermal_zone data structure + * and return this pointer. + * + * TODO: Missing properties to parse: thermal-sensor-names and coefficients + * + * Return: On success returns a valid struct __thermal_zone, + * otherwise, it returns a corresponding ERR_PTR(). Caller must + * check the return value with help of IS_ERR() helper. + */ +static struct __thermal_zone * +thermal_of_build_thermal_zone(struct device_node *np) +{ + struct device_node *child = NULL, *gchild; + struct __thermal_zone *tz; + int ret, i; + u32 prop; + + if (!np) { + pr_err("no thermal zone np\n"); + return ERR_PTR(-EINVAL); + } + + tz = kzalloc(sizeof(*tz), GFP_KERNEL); + if (!tz) + return ERR_PTR(-ENOMEM); + + ret = of_property_read_u32(np, "polling-delay-passive", &prop); + if (ret < 0) { + pr_err("missing polling-delay-passive property\n"); + goto free_tz; + } + tz->passive_delay = prop; + + ret = of_property_read_u32(np, "polling-delay", &prop); + if (ret < 0) { + pr_err("missing polling-delay property\n"); + goto free_tz; + } + tz->polling_delay = prop; + + /* trips */ + child = of_get_child_by_name(np, "trips"); + + /* No trips provided */ + if (!child) + goto finish; + + tz->ntrips = of_get_child_count(child); + if (tz->ntrips == 0) /* must have at least one child */ + goto finish; + + tz->trips = kzalloc(tz->ntrips * sizeof(*tz->trips), GFP_KERNEL); + if (!tz->trips) { + ret = -ENOMEM; + goto free_tz; + } + + i = 0; + for_each_child_of_node(child, gchild) { + ret = thermal_of_populate_trip(gchild, &tz->trips[i++]); + if (ret) + goto free_trips; + } + + of_node_put(child); + + /* cooling-maps */ + child = of_get_child_by_name(np, "cooling-maps"); + + /* cooling-maps not provided */ + if (!child) + goto finish; + + tz->num_tbps = of_get_child_count(child); + if (tz->num_tbps == 0) + goto finish; + + tz->tbps = kzalloc(tz->num_tbps * sizeof(*tz->tbps), GFP_KERNEL); + if (!tz->tbps) { + ret = -ENOMEM; + goto free_trips; + } + + i = 0; + for_each_child_of_node(child, gchild) + ret = thermal_of_populate_bind_params(gchild, &tz->tbps[i++], + tz->trips, tz->ntrips); + if (ret) + goto free_tbps; + +finish: + of_node_put(child); + tz->mode = THERMAL_DEVICE_DISABLED; + + return tz; + +free_tbps: + kfree(tz->tbps); +free_trips: + kfree(tz->trips); +free_tz: + kfree(tz); + of_node_put(child); + + return ERR_PTR(ret); +} + +static inline void of_thermal_free_zone(struct __thermal_zone *tz) +{ + kfree(tz->tbps); + kfree(tz->trips); + kfree(tz); +} + +/** + * of_parse_thermal_zones - parse device tree thermal data + * + * Initialization function that can be called by machine initialization + * code to parse thermal data and populate the thermal framework + * with hardware thermal zones info. This function only parses thermal zones. + * Cooling devices and sensor devices nodes are supposed to be parsed + * by their respective drivers. + * + * Return: 0 on success, proper error code otherwise + * + */ +int __init of_parse_thermal_zones(void) +{ + struct device_node *np, *child; + struct __thermal_zone *tz; + struct thermal_zone_device_ops *ops; + + np = of_find_node_by_name(NULL, "thermal-zones"); + if (!np) { + pr_debug("unable to find thermal zones\n"); + return 0; /* Run successfully on systems without thermal DT */ + } + + for_each_child_of_node(np, child) { + struct thermal_zone_device *zone; + struct thermal_zone_params *tzp; + + tz = thermal_of_build_thermal_zone(child); + if (IS_ERR(tz)) { + pr_err("failed to build thermal zone %s: %ld\n", + child->name, + PTR_ERR(tz)); + continue; + } + + ops = kmemdup(&of_thermal_ops, sizeof(*ops), GFP_KERNEL); + if (!ops) + goto exit_free; + + tzp = kzalloc(sizeof(*tzp), GFP_KERNEL); + if (!tzp) { + kfree(ops); + goto exit_free; + } + + /* No hwmon because there might be hwmon drivers registering */ + tzp->no_hwmon = true; + + zone = thermal_zone_device_register(child->name, tz->ntrips, + 0, tz, + ops, tzp, + tz->passive_delay, + tz->polling_delay); + if (IS_ERR(zone)) { + pr_err("Failed to build %s zone %ld\n", child->name, + PTR_ERR(zone)); + kfree(tzp); + kfree(ops); + of_thermal_free_zone(tz); + /* attempting to build remaining zones still */ + } + } + + return 0; + +exit_free: + of_thermal_free_zone(tz); + + /* no memory available, so free what we have built */ + of_thermal_destroy_zones(); + + return -ENOMEM; +} + +/** + * of_thermal_destroy_zones - remove all zones parsed and allocated resources + * + * Finds all zones parsed and added to the thermal framework and remove them + * from the system, together with their resources. + * + */ +void of_thermal_destroy_zones(void) +{ + struct device_node *np, *child; + + np = of_find_node_by_name(NULL, "thermal-zones"); + if (!np) { + pr_err("unable to find thermal zones\n"); + return; + } + + for_each_child_of_node(np, child) { + struct thermal_zone_device *zone; + + zone = thermal_zone_get_zone_by_name(child->name); + if (IS_ERR(zone)) + continue; + + thermal_zone_device_unregister(zone); + kfree(zone->tzp); + kfree(zone->ops); + of_thermal_free_zone(zone->devdata); + } +} diff --git a/drivers/thermal/thermal_core.c b/drivers/thermal/thermal_core.c index 4f4b788..ed5f765 100644 --- a/drivers/thermal/thermal_core.c +++ b/drivers/thermal/thermal_core.c @@ -1355,7 +1355,7 @@ static void remove_trip_attrs(struct thermal_zone_device *tz) */ struct thermal_zone_device *thermal_zone_device_register(const char *type, int trips, int mask, void *devdata, - const struct thermal_zone_device_ops *ops, + struct thermal_zone_device_ops *ops, const struct thermal_zone_params *tzp, int passive_delay, int polling_delay) { @@ -1735,8 +1735,14 @@ static int __init thermal_init(void) if (result) goto unregister_class;
+ result = of_parse_thermal_zones(); + if (result) + goto exit_netlink; + return 0;
+exit_netlink: + genetlink_exit(); unregister_governors: thermal_unregister_governors(); unregister_class: @@ -1752,6 +1758,7 @@ error:
static void __exit thermal_exit(void) { + of_thermal_destroy_zones(); genetlink_exit(); class_unregister(&thermal_class); thermal_unregister_governors(); diff --git a/drivers/thermal/thermal_core.h b/drivers/thermal/thermal_core.h index 7cf2f66..3db339f 100644 --- a/drivers/thermal/thermal_core.h +++ b/drivers/thermal/thermal_core.h @@ -77,4 +77,13 @@ static inline int thermal_gov_user_space_register(void) { return 0; } static inline void thermal_gov_user_space_unregister(void) {} #endif /* CONFIG_THERMAL_GOV_USER_SPACE */
+/* device tree support */ +#ifdef CONFIG_THERMAL_OF +int of_parse_thermal_zones(void); +void of_thermal_destroy_zones(void); +#else +static inline int of_parse_thermal_zones(void) { return 0; } +static inline void of_thermal_destroy_zones(void) { } +#endif + #endif /* __THERMAL_CORE_H__ */ diff --git a/include/dt-bindings/thermal/thermal.h b/include/dt-bindings/thermal/thermal.h new file mode 100644 index 0000000..59822a9 --- /dev/null +++ b/include/dt-bindings/thermal/thermal.h @@ -0,0 +1,17 @@ +/* + * This header provides constants for most thermal bindings. + * + * Copyright (C) 2013 Texas Instruments + * Eduardo Valentin eduardo.valentin@ti.com + * + * GPLv2 only + */ + +#ifndef _DT_BINDINGS_THERMAL_THERMAL_H +#define _DT_BINDINGS_THERMAL_THERMAL_H + +/* On cooling devices upper and lower limits */ +#define THERMAL_NO_LIMIT (-1UL) + +#endif + diff --git a/include/linux/thermal.h b/include/linux/thermal.h index b4a975f..bd2533b 100644 --- a/include/linux/thermal.h +++ b/include/linux/thermal.h @@ -143,6 +143,7 @@ struct thermal_cooling_device { int id; char type[THERMAL_NAME_LENGTH]; struct device device; + struct device_node *np; void *devdata; const struct thermal_cooling_device_ops *ops; bool updated; /* true if the cooling device does not need update */ @@ -172,7 +173,7 @@ struct thermal_zone_device { int emul_temperature; int passive; unsigned int forced_passive; - const struct thermal_zone_device_ops *ops; + struct thermal_zone_device_ops *ops; const struct thermal_zone_params *tzp; struct thermal_governor *governor; struct list_head thermal_instances; @@ -232,8 +233,31 @@ struct thermal_genl_event { };
/* Function declarations */ +#ifdef CONFIG_THERMAL_OF +struct thermal_zone_device * +thermal_zone_of_sensor_register(struct device *dev, int id, + void *data, int (*get_temp)(void *, long *), + int (*get_trend)(void *, long *)); +void thermal_zone_of_sensor_unregister(struct device *dev, + struct thermal_zone_device *tz); +#else +static inline struct thermal_zone_device * +thermal_zone_of_sensor_register(struct device *dev, int id, + void *data, int (*get_temp)(void *, long *), + int (*get_trend)(void *, long *)) +{ + return NULL; +} + +static inline +void thermal_zone_of_sensor_unregister(struct device *dev, + struct thermal_zone_device *tz) +{ +} + +#endif struct thermal_zone_device *thermal_zone_device_register(const char *, int, int, - void *, const struct thermal_zone_device_ops *, + void *, struct thermal_zone_device_ops *, const struct thermal_zone_params *, int, int); void thermal_zone_device_unregister(struct thermal_zone_device *);