16 Jul
2013
16 Jul
'13
8:17 p.m.
On Tue, Jul 16, 2013 at 12:57:34PM -0700, Arjan van de Ven wrote:
then the question of how much remaining capacity; this is a hard one, and not just for Intel. Almost all mobile devices today are thermally constrained, ARM and Intel alike (at least the higher performance ones)... the curse of wanting very thin and light phones that are made of thermally isolating plastic (so that radio waves can go through) and have a nice and bright screen...
Right, so we might need to track a !idle avg over the thermal domain to guestimate the head-room and inter-cpu relations.
But yeah, I suppose what I've been saying is that we need to drag cpufreq into the SMP era. Only considering a single cpu isn't going to work anymore.