On 10-05-15, 20:07, Nishanth Menon wrote:
just one minor concern being in the SoC end of the world :). In most times, the current consumption for a specific OPP varies depending on the specific location in the process node the die is -> this is even true among a single lot of wafers as well. some SoC vendors use hot, nominal and cold terminology to indicate the characteristics of the specific sample.
it might help state which sample end of the spectrum we are talking about here. reason being: if I put in values based on my board measurement, the results may not be similar to what someone else's sample be. Depending on technology, speed binning strategy used by the vendor, temperature and few other characteristics, these numbers could be widely divergent.
I don't have any clue about this.. :(
@Mark/stephen: Any inputs ?