From: Punit Agrawal punit.agrawal@arm.com
When binding cooling devices to thermal zones created from the device tree the minimum and maximum cooling states are in the wrong order leading to failure to bind.
Fix the order of cooling states in the call to thermal_zone_bind_cooling_device to fix this.
Cc:Zhang Rui rui.zhang@intel.com Signed-off-by: Punit Agrawal punit.agrawal@arm.com Reviewed-by: Stephen Boyd sboyd@codeaurora.org Signed-off-by: Zhang Rui rui.zhang@intel.com (cherry picked from commit dd354b84d47ec8ca53686bdb3cc1aecdeb75bef5) Signed-off-by: Alex Shi alex.shi@linaro.org --- drivers/thermal/of-thermal.c | 4 ++-- 1 file changed, 2 insertions(+), 2 deletions(-)
diff --git a/drivers/thermal/of-thermal.c b/drivers/thermal/of-thermal.c index 04b1be7..97d312f 100644 --- a/drivers/thermal/of-thermal.c +++ b/drivers/thermal/of-thermal.c @@ -156,8 +156,8 @@ static int of_thermal_bind(struct thermal_zone_device *thermal,
ret = thermal_zone_bind_cooling_device(thermal, tbp->trip_id, cdev, - tbp->min, - tbp->max); + tbp->max, + tbp->min); if (ret) return ret; }