From: "hongbo.zhang" hongbo.zhang@linaro.com
V2->V3 Changes:
1. Moved the previous "[PATCH V2 2/6] Thermal: make sure cpufreq cooling register after cpufreq driver" from generic cpu cooling layer to ST-Ericsson driver, thus only 5 patches in total in V3 patch set.
2. Update ST-Ericsson thermal driver due to review comments from Viresh Kumar and Francesco Lavra.
hongbo.zhang (5): Thermal: add indent for code alignment. Thermal: fix bug of counting cpu frequencies. Thermal: Remove the cooling_cpufreq_list. Thermal: Add ST-Ericsson DB8500 thermal driver. Thermal: Add ST-Ericsson DB8500 thermal properties and platform data.
.../devicetree/bindings/thermal/db8500-thermal.txt | 40 ++ arch/arm/boot/dts/dbx5x0.dtsi | 14 + arch/arm/boot/dts/snowball.dts | 31 ++ arch/arm/configs/u8500_defconfig | 4 + arch/arm/mach-ux500/board-mop500.c | 64 +++ drivers/thermal/Kconfig | 20 + drivers/thermal/Makefile | 2 + drivers/thermal/cpu_cooling.c | 103 +--- drivers/thermal/db8500_cpufreq_cooling.c | 108 +++++ drivers/thermal/db8500_thermal.c | 531 +++++++++++++++++++++ include/linux/platform_data/db8500_thermal.h | 38 ++ 11 files changed, 878 insertions(+), 77 deletions(-) create mode 100644 Documentation/devicetree/bindings/thermal/db8500-thermal.txt create mode 100644 drivers/thermal/db8500_cpufreq_cooling.c create mode 100644 drivers/thermal/db8500_thermal.c create mode 100644 include/linux/platform_data/db8500_thermal.h