From: "hongbo.zhang" hongbo.zhang@linaro.com
V3->V4 Changes:
1. In previous patch set V3 "Fix thermal bugs and Upstream ST-Ericsson thermal driver", there were 5 patches in total, since the first 3 for fixing thermal layer bugs have been accepted by the maintainer, I'd like to send out the updated last 2 only this time, for upstreaming ST-Ericsson thermal driver.
2. In patch "Thermal: Add ST-Ericsson DB8500 thermal driver" - typo in commit message: diver -> driver; - add more explanation of device tree properties are optional or required. - in function db8500_thermal_match_cdev: remove cdev_name, use trip_points->cdev_name[i] directly instead; - in function db8500_cdev_bind: move cdev->ops->get_max_state(cdev, &max_state) out of for loop to call it only once; - in function db8500_thermal_parse_dt: update checking strlen(tmp_str) >= THERMAL_NAME_LENGTH - add Reviewed-by: Viresh Kumar viresh.kumar@linaro.org - add Reviewed-by: Francesco Lavra francescolavra.fl@gmail.com
3. In patch "Thermal: Add ST-Ericsson DB8500 thermal properties and platform data" - add Reviewed-by: Viresh Kumar viresh.kumar@linaro.org
hongbo.zhang (2): Thermal: Add ST-Ericsson DB8500 thermal driver. Thermal: Add ST-Ericsson DB8500 thermal properties and platform data.
.../devicetree/bindings/thermal/db8500-thermal.txt | 44 ++ arch/arm/boot/dts/dbx5x0.dtsi | 14 + arch/arm/boot/dts/snowball.dts | 31 ++ arch/arm/configs/u8500_defconfig | 2 + arch/arm/mach-ux500/board-mop500.c | 64 +++ drivers/thermal/Kconfig | 20 + drivers/thermal/Makefile | 2 + drivers/thermal/db8500_cpufreq_cooling.c | 108 +++++ drivers/thermal/db8500_thermal.c | 530 +++++++++++++++++++++ include/linux/platform_data/db8500_thermal.h | 38 ++ 10 files changed, 853 insertions(+) create mode 100644 Documentation/devicetree/bindings/thermal/db8500-thermal.txt create mode 100644 drivers/thermal/db8500_cpufreq_cooling.c create mode 100644 drivers/thermal/db8500_thermal.c create mode 100644 include/linux/platform_data/db8500_thermal.h