On 11/15/2012 01:51 PM, Zhang Rui wrote:
On Thu, 2012-11-15 at 18:56 +0800, hongbo.zhang wrote:
From: "hongbo.zhang" hongbo.zhang@linaro.com
This driver is based on the thermal management framework in thermal_sys.c. A thermal zone device is created with the trip points to which cooling devices can be bound, the current cooling device is cpufreq, e.g. CPU frequency is clipped down to cool the CPU, and other cooling devices can be added and bound to the trip points dynamically. The platform specific PRCMU interrupts are used to active thermal update when trip points are reached.
Signed-off-by: hongbo.zhang hongbo.zhang@linaro.com Reviewed-by: Viresh Kumar viresh.kumar@linaro.org Reviewed-by: Francesco Lavra francescolavra.fl@gmail.com
Patch is refreshed and applied to thermal next. refreshed patch attached.
[...]
diff --git a/drivers/thermal/Kconfig b/drivers/thermal/Kconfig index 99b6587..d96da07 100644 --- a/drivers/thermal/Kconfig +++ b/drivers/thermal/Kconfig @@ -101,5 +101,25 @@ config EXYNOS_THERMAL If you say yes here you get support for TMU (Thermal Managment Unit) on SAMSUNG EXYNOS series of SoC. +config DB8500_THERMAL
- bool "DB8500 thermal management"
- depends on ARCH_U8500
Shouldn't it depend on THERMAL as well, as in Hongbo's original patch?
- default y
- help
Adds DB8500 thermal management implementation according to the thermalmanagement framework. A thermal zone with several trip points will becreated. Cooling devices can be bound to the trip points to cool thisthermal zone if trip points reached.+config DB8500_CPUFREQ_COOLING
- tristate "DB8500 cpufreq cooling"
- depends on ARCH_U8500
- depends on CPU_THERMAL
- default y
- help
Adds DB8500 cpufreq cooling devices, and these cooling devices can bebound to thermal zone trip points. When a trip point reached, thebound cpufreq cooling device turns active to set CPU frequency low tocool down the CPU.endif
-- Francesco