Changes since V1: *Moved the sensor driver to driver/thermal folder from driver/hwmon folder as suggested by Mark Brown and Guenter Roeck *Added notifier support to notify the registered drivers of any cpu cooling action. The driver can modify the default cooling behaviour(eg set different max clip frequency). *The percentage based frequency replaced with absolute clipped frequency. *Some more conditional checks when setting max frequency. *Renamed the new trip type THERMAL_TRIP_STATE_ACTIVE to THERMAL_TRIP_STATE_INSTANCE *Many review comments from R, Durgadoss durgadoss.r@intel.com and eduardo.valentin@ti.com implemented. *Removed cooling stats through debugfs patch *The V1 based can be found here, https://lkml.org/lkml/2012/2/22/123 http://lkml.org/lkml/2012/3/3/32
Changes since RFC: *Changed the cpu cooling registration/unregistration API's to instance based *Changed the STATE_ACTIVE trip type to pass correct instance id *Adding support to restore back the policy->max_freq after doing frequency clipping. *Moved the trip cooling stats from sysfs node to debugfs node as suggested by Greg KH greg@kroah.com *Incorporated several review comments from eduardo.valentin@ti.com *Moved the Temperature sensor driver from driver/hwmon/ to driver/mfd as discussed with Guenter Roeck guenter.roeck@ericsson.com and Donggeun Kim dg77.kim@samsung.com (https://lkml.org/lkml/2012/1/5/7) *Some changes according to the changes in common cpu cooling APIs *The RFC based patches can be found here, https://lkml.org/lkml/2011/12/13/186 https://lkml.org/lkml/2011/12/21/169
Brief Description:
1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This codes is architecture independent.
2) This patchset adds a new trip type THERMAL_TRIP_STATE_INSTANCE which passes cooling device instance number and may be helpful for cpufreq cooling devices to take the correct cooling action. This trip type avoids the temperature comparision check again inside the cooling handler.
3) This patchset adds generic cpu cooling low level implementation through frequency clipping and cpu hotplug. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c). But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a)struct thermal_cooling_device *cpufreq_cooling_register( struct freq_clip_table *tab_ptr, unsigned int tab_size, const struct cpumask *mask_val) b)void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev)
4) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver.
All this patchset is based on Kernel version 3.3-rc7
A simple data/control flow diagrams is shown below,
Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | |/ | Cpufreq cooling device <---------------
Amit Daniel Kachhap (6): thermal: Add a new trip type to use cooling device instance number thermal: Add generic cpufreq cooling implementation thermal: Add generic cpuhotplug cooling implementation hwmon: exynos4: Move thermal sensor driver to driver/thermal directory thermal: exynos4: Register the tmu sensor with the kernel thermal layer ARM: exynos4: Add thermal sensor driver platform device support
Documentation/hwmon/exynos4_tmu | 81 --- Documentation/thermal/cpu-cooling-api.txt | 76 +++ Documentation/thermal/exynos4_tmu | 52 ++ Documentation/thermal/sysfs-api.txt | 4 +- arch/arm/mach-exynos/Kconfig | 11 + arch/arm/mach-exynos/Makefile | 1 + arch/arm/mach-exynos/clock.c | 4 + arch/arm/mach-exynos/dev-tmu.c | 39 ++ arch/arm/mach-exynos/include/mach/irqs.h | 2 + arch/arm/mach-exynos/include/mach/map.h | 1 + arch/arm/mach-exynos/mach-origen.c | 1 + arch/arm/plat-samsung/include/plat/devs.h | 1 + drivers/hwmon/Kconfig | 10 - drivers/hwmon/Makefile | 1 - drivers/hwmon/exynos4_tmu.c | 514 ------------------- drivers/thermal/Kconfig | 21 + drivers/thermal/Makefile | 2 + drivers/thermal/cpu_cooling.c | 529 +++++++++++++++++++ drivers/thermal/exynos4_thermal.c | 790 +++++++++++++++++++++++++++++ drivers/thermal/thermal_sys.c | 45 ++- include/linux/cpu_cooling.h | 78 +++ include/linux/platform_data/exynos4_tmu.h | 7 + include/linux/thermal.h | 1 + 23 files changed, 1660 insertions(+), 611 deletions(-) delete mode 100644 Documentation/hwmon/exynos4_tmu create mode 100644 Documentation/thermal/cpu-cooling-api.txt create mode 100644 Documentation/thermal/exynos4_tmu create mode 100644 arch/arm/mach-exynos/dev-tmu.c delete mode 100644 drivers/hwmon/exynos4_tmu.c create mode 100644 drivers/thermal/cpu_cooling.c create mode 100644 drivers/thermal/exynos4_thermal.c create mode 100644 include/linux/cpu_cooling.h